Abstract. The paper analyses the trend in packaging for low-power integrated circuits (IC) and the principal failures that can occur. A Fault-tree (FT) analysis is proposed, as well an analysis of the failure distribution (FD), which can be useful in safety-critical applications such as industrial and automotive.
S. Saponara, G. Ciarpi, L.Fanucci, "Failure analysis of plastic packages for low-power ICs", Lecture Notes in Electrical Engineering, 2017
Written by GABRIELE CIARPI
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