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Dr. Elisabetta Dimaggio, Dipartimento di Ingegneria dell’Informazione - Università di Pisa, "Nanofabrication technologies and tools for 1D&2D-material based devices", 18,19,22,24 janaury 2024

Hours:
16 hours (4 credits)

Room:

Aula Riunioni del Dipartimento di Ingegneria dell’Informazione, Via G. Caruso 16, Pisa - Ground Floor

To register to the course, click here

Short Abstract:

Nanofabrication techniques have been the keystone for the scaling down of electronic devices in the semiconductor industry, but have also revolutionized other fields, being the means for the integration of nanodevices into various systems and contexts. Core components of nanodevices are low-dimensional semiconductive materials, which have allowed to boost the integration densities, but have also enabled the study and comprehension of various physical phenomena relying on their characteristic properties. This course is meant to give an overview of the methods and tools required for the fabrication of devices based on one-dimensional (1D) and two-dimensional (2D) materials, which are the result of a body of knowledge in electronics, physics and material science. Particular focus will be given to hybrid processes that combine standard CMOS techniques, e.g. lithography, thin film deposition, chemical vapor deposition, wet and dry etchings, with alternative techniques for fast prototyping of electronic devices, such as ink-jet printing. Through these processes, 1D&2D materials can be integrated together with bulk materials allowing the complete definition of electronic devices, which can be further collected in large-area networks. Case studies related to emergent fields of application, such as energy harvesting and flexible electronics will be discussed and supported by practical examples of fabrication workflows.

Course Contents in brief:

  1. Overview of standard fabrication methods for integrated devices
  2. Nanofabrication tools for micro and nanoscale devices
  3. Beyond the standards: alternative materials and technologies on flexible substrates
  4. Dive into practice: integration workflow from lithography to metal contacts and 2D-materials printi

Schedule:

  1. Day 1 – Thursday, 18 January 2024, from 14:00 to 18:00 (4 hours)
  2. Day 2 – Friday, 19 January 2024, from 14:00 to 18:00 (4 hours)
  3. Day 3 – Monday, 22 January 2024, from 14:00 to 18:00 (4 hours)
  4. Day 4 – Wednesday, 24 January 2024, from 14:00 to 18:00 (4 hours)