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Elenco Pubblicazioni - Publications (1288)

P. Del Fiorentino, J. Van Hecke, V. Lottici, F. Giannetti and M. Moeneclaey, “Goodput-based Re-source Allocation and DF Relay Selection for Dual-Hop Transmissions with Packet-oriented Cog-nitive BIC-OFDM Systems,” presented to Joint NEWCOM/COST Wo

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We propose a novel resource allocation (RA) strategy for a cognitive radio packet-oriented bit-interleaved coded orthogonal frequency division multiplexing (BIC-OFDM) system with decode-and-forward (DF) relays. The aim of the RA is maximizing the goodput (GP)…
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S. B. Godfrey, C. Piazza, M.G. Catalano, M. Rossi, A. Bicchi: " The SoftHand Pro-H: a shoulder-driven, motor-actuated prosthetic solution"

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 Body-powered and myoelectric prosthetic terminal devices have similarly high rates of rejection: 26 and 23%, respectively. This is in part because, despite technological advances, each comes with distinct advantages and disadvantages. The SoftHand Pro-H marries…
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C. Piazza, C. Della Santina, M.G. Catalano, G. Grioli, M. Garabini, A. Bicchi: "SoftHand Pro-D: Matching dynamic content of natural user commands with hand embodiment for enhanced prosthesis control"

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State of the art of hand prosthetics is divided between simple and reliable gripper-like systems and sophisticate hi-tech poly-articular hands which tend to be complex both in their design and for the patient to operate.…
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C. Piazza, C. Della Santina, G.M. Gasparri, M.G. Catalano, G. Grioli, M. Garabini, A. Bicchi: "SoftFoot: an Adaptive Foot for Natural Walking"

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Many walking robot presented in literature stand on rigid flat feet, with a few notable exceptions that embed flexibility in their feet to optimize the energetic cost of walking. This paper proposes a novel adaptive…
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M. Piotto, A. Di Pancrazio, L. Intaschi, P. Bruschi "An integrated thermal flow sensor for liquids based on a novel technique for electrical insulation"

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A novel method to electrically insulate integrated thermal flow sensors from liquids is proposed. The sensor is fabricated with a post-processing technique applied to chips designed with a commercial CMOS process. A low cost packaging…
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